COMPEX WLE7002E56 11be 2x2 miniPCIe, WiFi 7 5 + 6 GHz 801.11be dual band DBDC module, QCN 9274 / 6274, Waikiki, PCIe 3.0

• Qualcomm QCN6274 ‘Waikiki’ series for Commercial grade
• Qualcomm QCN9274 ‘Waikiki’ series for Industrial grade
• 5GHz, 2×2 MU-MIMO, up to 2882 Mbps physical datarate
• 6GHz, 2×2 MU-MIMO, up to 5765 Mbps physical datarate
• Dual-Band Concurrent 5+6GHz WiFi 7 (802.11be)
• MiniPCIe Interface with PCIe 3.0
  • Based on WK01.7 reference design
  • Supports up to 4096-QAM
  • -20°C to 70°C operating temperature for commercial grade• -40°C to 85°C operating temperature for industrial grade

Chipset Qualcomm QCN6274 ‘Waikiki’ series for Commercial Grade Qualcomm QCN9274 ‘Waikiki’ series for Industrial Grade

System Memory 2Mbit serial I²C bus EEPROM
Reference Design WK01.7
Host Interface MiniPCIe Interface with PCIe 3.0
Operating Voltage 3.3V
Power Consumption 8.7W(Max)
Wireless 5GHz 802.11a/n/ax/be, max 19 dBm per chain
6GHz 802.11a/n/ax/be, max 19 dBm per chain
4x U.FL Connectors Frequency Range 5GHz: 5.150~5.825GHz 6GHz: 5.945~7.125GHz Modulation Techniques OFDMA: BPSK, QPSK, DBPSK, DQPSK, 16-QAM, 64-QAM, 256-QAM,1024QAM, 4096QAMChannel Spectrum Widths for WLAN Supports 20/40/80/160 MHz at 5GHz Supports 20/40/80/160/320 MHz at 6GHz Operating Systems OpenWRT
Certification REACH & RoHS Compliance Environmental Temperature Operating(Commercial Grade): -20°C to 70°C, Storage: -40°C to 90°C
Operating(Industrial Grade): -40°C to 85°C, Storage: -40°C to 90°C
Environmental Humidity, Non-Condensing Operating: 5% to 95%, Storage: Max. 90%
Dimensions (W x H x D) in mm 30 X 50.8 X 13 mm